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#077 / 2026-05-25 TECH · AI / Semi / SaaS

NVIDIA Blackwell Ultra Ramps to Full Production
— TSMC CoWoS-L Crunch and HBM3E Race Define the Next AI Infrastructure Cycle

🗓 2026-05-25 Auto-generated 06:30 JST / 🧠 HumanAI (COOL) / ~5529 chars

In May 2026, NVIDIA's next-generation GPU 'Blackwell Ultra (B200X)' has entered full-volume production on TSMC's advanced CoWoS-L packaging line. Combined with tight HBM3E supply and data center liquid-cooling power constraints, the AI infrastructure investment cycle is entering a new phase.

1. Blackwell Ultra — Full Spec Profile and Production Timeline

The NVIDIA B200X (Blackwell Ultra) combines a GPU die manufactured on TSMC's 3nm (N3E) process with CoWoS-L (Chip-on-Wafer-on-Substrate, Local) advanced packaging. Compared to the previous-generation H100 (Hopper), FP8 inference throughput is reportedly approximately 4x higher, while the HBM3E ×8 stack configuration brings total memory bandwidth to 9.6 TB/s. [Source: NVIDIA GTC 2026 Presentation Materials]

The mass production schedule was initially announced for Q1 2026, but yield improvements on the CoWoS-L process took longer than expected, pushing large-scale shipments to mid-Q2 (May). TSMC's Zhunan and Taichung fabs are handling the primary CoWoS-L capacity, with a reported +35% quarter-over-quarter expansion in wafer equivalent output now complete. [Source: DigiTimes, May 2026]

2. HBM3E Supply Chain — The SK Hynix vs. Samsung Competition

SK Hynix currently maintains the largest share of HBM3E supply for the B200X, accounting for approximately 55–60% of total supply. Samsung has seen delayed large-scale adoption by NVIDIA due to HBM3E quality issues (thermal performance and yield), with its approval rate reportedly around 25% as of Q2 2026. Micron handles the remaining 15–20% and is said to be beginning HBM4 sample shipments shortly. [Source: The Elec, May 2026]

The HBM3E supply crunch is expected to persist for the next 2–3 quarters, with analysts estimating the average selling price (ASP) has risen +18% compared to end-2025. This price increase pushes up the cost of entire GPU systems, directly affecting cloud provider capex plans. Microsoft Azure, Google Cloud, and AWS have all revised their fiscal 2026 capex guidance upward, reaffirming the strength of AI infrastructure demand. [Source: Bloomberg Intelligence, May 2026]

3. Data Center Power and Liquid Cooling — The 'Power Wall' of AI Clusters

The NVL8 rack, housing 8 B200X GPUs, demands up to 120kW of power consumption per rack. Conventional air cooling is no longer sufficient, making direct liquid cooling (DLC) or immersion cooling effectively mandatory. Liquid cooling infrastructure players like Vertiv (VRT) have seen their order backlogs reach +42% compared to end-2025, with the stock trading steadily at $327.46 (+1.26%) today. [Source: Vertiv Q1 2026 Earnings, NVIDIA DGX B200X Spec Sheet]

The power challenge is also influencing data center site selection. Microsoft has been expanding long-term power purchase agreements (PPAs) with nuclear power operators (SMR: Small Modular Reactors), reportedly targeting 5GW of dedicated AI data center power by 2030. Google DeepMind is in partnership discussions with fusion startup Commonwealth Fusion, making it increasingly clear that securing long-term stable power is directly tied to competitive advantage in AI development. [Source: Reuters, May 2026]

4. NVDA Stock and Investor Perspective — Macro Environment Through a Tech Lens

NVIDIA (NVDA) shares are trading at $215.33 today (-1.90% day-over-day), reflecting modest profit-taking. Despite the positive fundamental of accelerating Blackwell Ultra production, concerns over margin compression from rising HBM3E costs are generating near-term selling pressure. However, with USD/JPY holding at 158.90, Japanese investors continue to benefit from a structural tailwind on yen-denominated overseas AI equity returns.

On the macro front, U.S. Durable Goods Orders for April (due May 27, two days away) are worth monitoring. An expected reading of +0.4% (vs. prior +0.7%) could be read as a deceleration signal for capex cycles — yet AI-oriented data center spending remains a separate, resilient driver. On the Play axis connection, NVIDIA's DLSS 4-equipped GPU rollout continues to transform the PC gaming experience, with consumer GPU demand providing a structural floor for NVIDIA's non-datacenter segment.

📊 Nyaws Portfolio View

NYW-X holds steady at 35.95 today (NORMAL range). While the Blackwell Ultra production ramp is a positive tech fundamental, near-term margin concerns from HBM3E price inflation are offsetting it, leaving the risk index without sufficient upward pressure.

In the Nyaws 100, the AI axis has delivered the top 63-day return at +29.43%, followed by the Power axis at +19.77%, clearly reflecting surging demand for liquid cooling and power infrastructure. BTC has also been resilient at +16.82%, while Gold is deeply underwater at -14.02%.

The AI axis's +29.43% performance demonstrates that the Nyaws portfolio's comprehensive coverage of the Blackwell Ultra supply chain — spanning TSMC CoWoS, SK Hynix HBM3E, and Vertiv liquid cooling — has accurately captured the current AI infrastructure boom cycle.

Key watchpoints going forward are: (1) how much TSMC can expand CoWoS-L capacity in Q3, and (2) whether Samsung can resolve its HBM3E quality issues. Both are critical variables that will determine the directional momentum of the Nyaws AI axis.

Today's Data (May 25, 2026)

ItemValue
NVIDIA (NVDA)$215.33 (-1.90%)
Vertiv (VRT)$327.46 (+1.26%)
NIKKEI 22563,339 (+2.68%)
USD/JPY158.90 (-0.08%)
WTI 原油 / WTI Crude / น้ำมัน WTI$96.60/bbl (+0.26%)
HBM3E ASP 変化 / HBM3E ASP Change / การเปลี่ยนแปลง HBM3E ASP+18% vs. 2025年末 / vs. End-2025 / เทียบปลายปี 2025
TSMC CoWoS-L 拡張 / Expansion / การขยาย+35% QoQ (ウェーハ換算 / wafer equiv. / เทียบเท่าเวเฟอร์)
B200X NVL8 消費電力 / Power Draw / กำลังไฟ最大 120kW / rack
Vertiv Backlog 増 / Backlog Growth / การเติบโต Backlog+42% vs. 2025年末 / vs. End-2025 / เทียบปลายปี 2025
SK Hynix HBM3E シェア / Share / ส่วนแบ่ง~55–60%
📊 HumanAI's interpretation(COOL)The CoWoS-L yield improvement delay clearly signals that advanced packaging technology is becoming the new bottleneck in the semiconductor industry. The competitive landscape is shifting away from an era dominated by process node miniaturization (3nm, 2nm) toward an era of 'AI chips as infrastructure,' where packaging, memory bandwidth, and power density form an inseparable triad. NVIDIA's competitive moat now lies not just in chip design alone, but in its ecosystem-building capability with TSMC and HBM suppliers. In this configuration, a supply-chain-wide investment perspective becomes indispensable.

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Sources:

NVIDIA GTC 2026 Presentation Materials

DigiTimes — TSMC CoWoS Expansion Coverage (May 2026)

The Elec — HBM3E Supplier Share Analysis (May 2026)

Bloomberg Intelligence — AI Capex Report (May 2026)

Vertiv Q1 2026 Earnings Release

Reuters — Microsoft SMR Power Contract Coverage (May 2026)